Qualcomm Demonstrates Wireless Communications Beyond the Mobile Phone at GSMA Mobile World Congress 2009

Barcelona, Spain (ots/PRNewswire) -

Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and
innovator of advanced wireless technologies, products and services,
today unveiled its newest showcase of mobile devices and services at
GSMA Mobile World Congress 2009 (Booth B53, Hall 8), Feb. 16-19 in
Barcelona. The Company's demonstrations feature technologies that go
beyond mobile telephony to enable a variety of new markets and
business models. Highlights of the exhibit include demonstrations of
advanced HSPA+ technology, LTE, devices based on the Snapdragon(TM)
mobile computing platform, the Plaza mobile Internet solution and
Xiam discovery and recommendation technology, devices featuring
mirasol(TM) displays and the MediaFLO(TM) broadcast mobile TV
platform.

"The convergence of the wireless world with consumer electronics,
the Internet, digital content and services is changing the way people
interact with each other and with their environment," said Andrew
Gilbert, executive vice president of Qualcomm and president of
Qualcomm Internet Services, MediaFLO Technologies and Qualcomm
Europe. "Qualcomm's continued focus on innovation is leading this
transformation in Europe and around the world. We are excited to once
again showcase Qualcomm's latest technology innovations at Mobile
World Congress."

Qualcomm's technology exhibits and live demonstrations during the
conference include:

- Video streaming on HSPA+ MIMO enabling peak rates of 28 Mbps on
the downlink

- Mobile computing devices from leading manufacturers based on
Qualcomm's Snapdragon chipset, including Toshiba's TG01 Smartphone
and Wistron's PBook and CP610 devices

- A variety of commercial laptops equipped with the embedded 3G
Gobi(TM) module for Internet connectivity

- A wide range of commercial handsets based on Qualcomm's
MSM7xxx(TM)-series chipsets supporting major mobile operating systems

- A live demonstration of standards-compliant LTE technology
interoperable between third-party infrastructure and Qualcomm device
platforms

- HSPA+ R8 multicarrier technology, which enables operators to
deliver doubled data rates to all users with a significantly enhanced
broadband experience

- A citywide demonstration of the MediaFLO broadcast mobile TV
platform, including 30 channels of international content and
interactive applications that allow users to chat, vote, rate shows
and update their social networking site while watching TV

- Qualcomm's wireless network services for telehealth, asset
tracking and other applications, and a display showcasing commercial
products using these services, including the Peek mobile email device
and CardioNet mobile cardiac monitoring diagnostic device

- Various consumer products based on Qualcomm's mirasol display
technology, which extends battery life and enables clear viewing in
nearly any light; products featured include the newly revealed
Inventec V112 smartphone and the Cal-Comp iT810 handset, as well as
the Hisense C108, Skullcandy's MFM Pro Headphones featuring the color
mirasol display and a UMTS camera monitoring system

- Demonstrations of Qualcomm's Plaza, which helps users take
their online lives mobile via widgets from both the handset and Web,
the Plaza Publisher experience including the Mobile Portal and
Publisher Web Portal and additional monetization opportunities for
operators with Plaza

- Xiam's discovery and recommendations platform, which allows
mobile consumers to intuitively discover exciting content that is
relevant to their individual interests and tastes; Xiam also will
showcase its recently announced algorithms that make location-aware
and assisted mobile Internet recommendations

- Qualcomm's Wireless Reach(TM) initiative, which creates
programs and solutions that demonstrate how wireless technology can
improve people's lives, will be featuring the system for "3G for All
Generations," a pilot project in Spain that uses 3G to connect
elderly people to their caregivers and families

Qualcomm executives also will discuss wireless industry trends
during the following speakerships:

- Flavio Mansi, senior vice president and president of Qualcomm
Latin America, will participate in the Mobile Broadband for All
Workshop showcasing the economics of deploying HSPA for growth on
Monday, Feb, 16 from 10:30 a.m.-1 p.m. in Hall 5, Level 3, Office 6

- Andrew Gilbert, executive vice president and president of
Qualcomm Internet Services, Qualcomm MediaFLO Technologies and
Qualcomm Europe, will speak during the "New Embedded Mobile Economy"
panel on Monday, Feb. 16 from 1:15-2 p.m. in Hall 5, Auditorium 3

- Dr. Paul E. Jacobs, CEO of Qualcomm, will participate in a
panel discussion during the "Telecom Industry's Response to the
Economic Crisis" panel at the Leadership Summit and Government Mobile
Forum taking place on Monday, Feb. 16 from 2:30-4 p.m. at the
National Palace above Halls 6 and 7

- Alex Katouzian, vice president of product management, will
speak at the Mobile Broadband Evolution seminar on Monday, Feb. 16
from 2:30-5 p.m. in Hall 5, Level 3, Office 6

- Kevin Hunter, director of product management for Plaza, will
participate on a panel at "The Mobile Application Developer Garage"
on Monday, Feb. 16 from 4-4:45 p.m. in Hall 5, Level 0, Auditorium 3

- Bill Bold, senior vice president of government affairs, will
participate in a regulatory panel on Tuesday, Feb. 17 from 2:15-3:45
p.m. in the Verdi Room of the Fira Convention Center

- Fram Akiki, senior director of product management, will speak
at the GSMA Mobile Broadband Seminar - MBB Notebooks Guidelines on
Tuesday, Feb. 17 from 10:30 a.m.-1 p.m. in Hall 5, Level 3, Office 6

- Noam Raffaelli, managing director of Plaza, will participate in
a panel discussion on "The Business of Mobile 2.0" on Tuesday, Feb.
17 from 3-3:45 p.m. in Hall 5, Level 0, Auditorium 3

- Dr. Paul E. Jacobs will give a keynote speech during the Mobile
Broadband panel on Wednesday, Feb. 18 from 9-10:30 a.m. in Hall 5,
Level 3, Auditorium 1

- Roberto Di Pietro, vice president of marketing for Qualcomm
Italy, will participate in a panel discussion on "Key Technical &
Business Aspects of NW Evolution" as part of the "Technology
Evolution Developed with NGMN" session on Thursday, Feb. 19 from
3:40-4 p.m. in Hall 5, Level 0, Auditorium 2

- Colm Healy, vice president and general manager of Qualcomm
subsidiary Xiam Technologies, will participate in the panel
discussion "Mobile Advertising - Moving to the Strategic Level" on
Thursday, Feb. 19 from 3:15-4 p.m. in Hall 5, Level 0, Auditorium 3

Qualcomm Incorporated (Nasdaq: QCOM) is a leader in developing
and delivering innovative digital wireless communications products
and services based on CDMA and other advanced technologies.
Headquartered in San Diego, Calif., Qualcomm is included in the S&P
100 Index, the S&P 500 Index and is a 2008 FORTUNE 500(R) company.
For more information, please visit www.qualcomm.com .

Qualcomm is a registered trademark of Qualcomm Incorporated.
eZone, Gobi, MediaFLO, MSM, Snapdragon and Wireless Reach are
trademarks of Qualcomm Incorporated. mirasol is a trademark of
Qualcomm MEMS Technologies Inc. All other trademarks are the property
of their respective owners.

Nothing in this press release is an offer to sell any of the
parts referenced herein. This press release may reference and/or show
images of parts and/or devices utilizing parts whose manufacture,
use, sale, offer for sale, or importation into the United States are
subject to certain injunctions against Qualcomm. This press release
is intended solely to provide information for those products and uses
of products that are outside the scope of the injunctions. Any device
utilizing 1x-EVDO parts that are intended for activation on a U.S.
wireless network (other than Verizon Wireless) must utilize
Qualcomm's hybrid mode alternative solution.

Qualcomm Contacts:
Richard Tinkler, Qualcomm Europe
Phone: +44-208-466-0874
Email: rtinkler@qualcomm.com
Tina Asmar, Corporate Communications
Phone: +1-858-845-5959
Email: corpcomm@qualcomm.com
John Gilbert, Investor Relations
Phone: +1-858-658-4813
Email: ir@qualcomm.com

ots Originaltext: Qualcomm Incorporated
Im Internet recherchierbar: http://www.presseportal.de

Contact:
Richard Tinkler, Qualcomm Europe, +44-208-466-0874,
rtinkler@qualcomm.com; or Tina Asmar, Corporate Communications,
+1-858-845-5959, corpcomm@qualcomm.com; John Gilbert, Investor
Relations, +1-858-658-4813, ir@qualcomm.com