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Atmel Introduces the Industry's First 128K-bit Serial EEPROM in an 8-pin Ultra Thin MLP (2 x 3mm) Leadless Package

Geschrieben am 09.07.2007 - [Nächster Artikel]

San Jose, California (ots/PRNewswire) -

- New Package Offers 33% Thickness Savings

Atmel(R) Corporation (Nasdaq: ATML) announced today the industry's
first 128K-bit Serial EEPROM device in an 8-pin ultra thin MLP (2 x
3mm) leadless package with overall height of 0.60mm.

The 8-pin ultra thin MLP (2 x 3 x 0.60mm) package is now offered
in densities from 1K-bit to 128K-bit for the 2-wire Serial EEPROM
(AT24) and 1K-bit to 64K-bit in the SPI Serial EEPROM (AT25) family.
This package is ideal for compact and portable consumer applications
such as MP3 players, digital cameras and remote controls. In
addition, the MLP package is ideal for a wide range of height
constrained communication applications including, Bluetooth modules
and mobile phones. Traditionally, the MLP (2 x 3mm) package has been
limited to low density Serial EEPROM devices. Atmel is the first to
market this package for high-density Serial EEPROM devices up to
128K-bit. Previously, the highest available density by the industry
in a 2X3 mm MLP was a 32K Serial EEPROM.

"Fitting a 128K-bit Serial EEPROM in an ultra thin MLP package
offers designers with maximum flexibility, in board space savings and
overall height, while maintaining the capability to migrate up in
density from 1K-bit up to 128K-bit without changing the board
layout," said Bassam Khoury, Managing Director for the Serial
Interface Product Line. "Atmel's leading edge technology enabled us
to accomplish this breakthrough in package technology."

Availability

The ultra thin MLP (2 x 3mm) package is available now in densities
from 1K-bit up to 128K-bit in the 2-wire family and 1K-bit up to
64K-bit in the SPI family. The 8-pin MLP package is offered in a
Pb-Free (Green), Halogen-Free and RoHS compliant packaging with the
industry's high reliability NiPdAu finish.

About Atmel

Atmel is a worldwide leader in the design and manufacture of
microcontrollers, advanced logic, mixed-signal, nonvolatile memory
and radio frequency (RF) components. Leveraging one of the industry's
broadest intellectual property (IP) technology portfolios, Atmel is
able to provide the electronics industry with complete system
solutions focused on consumer, industrial, security, communications,
computing and automotive markets.

(C) 2007 Atmel Corporation. All Rights Reserved. Atmel(R), logo
and combinations thereof, and others, are registered trademarks, or
trademarks of Atmel Corporation or its subsidiaries. Other terms and
product names may be trademarks of others.

Information:

For more information on Atmel's MLP packages in a 128K density, go
to: http://www.atmel.com/dyn/products/product_card.asp?family_id=647&
family_n ame=Serial+EEPROM&part_id=4073

For more information on Atmel's EEPROM products, go to:
http://www.atmel.com/atmel/products/prod6.htm

Press Contacts:
Bassam Khoury, Managing Director of Serial Interface Products
Phone: +1-408-436-4241, Email: bkhoury@atmel.com
Helen Perlegos, Public Relations - USA and Asia Pacific Rim
Phone: +1-408-487-2963, Email: hperlegos@atmel.com
Veronique Sablereau, Corporate Communications Manager - Europe
Phone: +33-1-30-60-70-68, Fax: +49-71-31-67-24-23
Email: veronique.sablereau@atmel.com

ots Originaltext: Atmel Corporation
Im Internet recherchierbar: http://www.presseportal.de

Contact:
Bassam Khoury, Managing Director of Serial Interface Products,
+1-408-436-4241, bkhoury@atmel.com, or Helen Perlegos, Public
Relations -USA and Asia Pacific Rim, +1-408-487-2963,
hperlegos@atmel.com, or Veronique Sablereau, Corporate Communications
Manager - Europe, +33-1-30-60-70-68, or fax, + 49-71-31-67-24-23,
veronique.sablereau@atmel.com, all of Atmel Corporation
 
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