EANS-News: DEWB investment holding KSW Microtec showcases new generation Thinlam® at ICMA EXPO

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Company Information

Dresden, Germany, April 27, 2010 (euro adhoc) - KSW Microtec, one of
the world´s leading suppliers of RFID components and inlays for
secure cards and other form factors, will be highlighting its new
generation of thinnest RFID prelaminates for eGovernment, ePayment
and high security applications at ICMA EXPO from May 2nd to 5th.

Along with its industry partner, AreCon, a consulting firm for smart
card manufacturers and a distributor of premium semi-finished smart
card products, KSW Microtec will provide visitors an insight into its
manufacturing expertise which brings unrivalled innovations to
market, such as its latest and proven polycarbonate prelaminate,
Thinlam®. This innovative family of inlays enables the implementation
of a variety of additional card layers for security features without
exceeding the allowed card thickness.

Thinlam® particularly targets governments, financial institutions and
other high-security conscious institutions who constantly demand
additional security features on all forms of ID cards, financial
cards and documents for authentication, validation and access. In
order to achieve this increasing need, multiple foil layers need to
be added and large memory security microcontrollers need to be
incorporated into cards and documents, while maintaining ISO
standards for maximum card thickness - and Thinlam® with a thickness
of 270µm is fit for purpose.

Today, given its proven capabilities, Thinlam® is used in passports,
driver´s licenses and ID cards as well as for e-payment applications
worldwide. Since the prelaminate is available in volume - and used in
volume, issuers are guaranteed availability, durability and
reliability.

As both sides of the card are fully opaque executable, both the chip
and the antenna are visually screened. Therefore any potential
deformation areas on the card are avoided when using KSWs Thinlam®.
Other common restrictions regarding visual card personalization are
eliminated, allowing for new features to be applied above the chip
area of the card if required. Furthermore, electrical and mechanical
performance, such as electrical parameter stability, is enhanced.
Thinlam® is available in polycarbonate, PVC, PET or Teslin® and can
also be used for transparent RFID cards due to the excellent optical
appearance.

At ICMA EXPO, KSW Microtec will showcase further new and innovative
products besides Thinlam®, such as its mobile phone sticker for
contactless payment applications. The company´s collaboration with
AreCon, who represents companies such as PET foil manufacturers Agfa
Materials, high security software developers for card applications
Monet+ and AdvanIDe, will add value for all those attending ICMA
EXPO. Both companies look forward to welcoming their partners and
customers to the show and sharing their expert insights on
technological and business developments and opportunities in both
existing and emerging markets for advanced card security.

Visit KSW Microtec at ICMA EXPO, Marriott Camelback Inn, Scottsdale,
Arizona, on Booth 3

About KSW KSW Microtec AG, with its headquarters in Germany, is the
world´s leading supplier of RFID (Radio Frequency Identification)
components for applications such as eTicketing, ePayment, Asset
Management, Access Control and High Security. KSW combines successful
high-end wafer processing, extremely efficient assembly technology
and far-reaching expertise in design. KSW has earned itself a leading
position on the market as one of the most efficient, and
simultaneously most flexible, producers of RFID components. The
globally active company was founded in 1994 and has clean room
production facilities in Germany. KSW is an investment holding of the
listed venture capital company Deutsche Effecten- und
Wechsel-Beteiligungsgesellschaft AG (DEWB) headquartered in Jena. For
more information see: www.ksw-microtec.de

For further information, please contact:

Sandra Jaunich
KSW Microtec AG
Manfred-von-Ardenne-Ring 12
01099 Dresden - Germany
Tel: +49 351 889 60 28
Fax: +49 351 889 60 11
sandra.jaunich@ksw-microtec.de
www.ksw-microtec.de

Media contact:
Tim Cockerell
Wise Media S.p.A.
Via Lepetit 4
20124 Milano - Italy
Tel: +39 02 8903 4126
Fax: +39 02 67388322
tim.cockerell@wisemedia.com
www.wisemedia.com

end of announcement euro adhoc
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ots Originaltext: Deutsche Effecten- und Wechsel-Beteiligungsges. AG (DEWB)
Im Internet recherchierbar: http://www.presseportal.de

Further inquiry note:

Marco Scheidler

Tel.: +49 (0) 3641 573-3600

E-Mail: marco.scheidler@dewb-vc.com

Branche: Financial & Business Services
ISIN: DE0008041005
WKN: 804100
Index: CDAX, Classic All Share
Börsen: Berlin / free trade
Stuttgart / free trade
München / free trade
Frankfurt / regulated dealing/general standard