EANS-News: Security for contactless government ID with KSW Microtec Thinlams®

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New Products

Dresden, Germany, March 29, 2010 (euro adhoc) - As governments,
financial institutions and other high-security conscious institutions
require additional security features on their contactless ID
documents and cards, KSW Microtec, one of the world´s leading
supplier of RFID components and inlays for secure cards and other
form factors, reports an increase in demand for its proven
prelaminate Thinlam®.

Issuers of highly secure cards and documents of all types,
increasingly demand the addition of new security features. In order
to achieve this, multiple layers need to be added and large memory
security microcontrollers need to be integrated, while maintaining
ISO standards for maximum card thickness. KSW´s polycarbonate inlay
Thinlam® is already widely used for this purpose, due to its
producible thinness down to 200µm and proven ability to support the
manufacturers of contactless documents with multiple layers and
security features.

Furthermore, special construction techniques provide a mechanical
stability due to KSW´s patented working technology for both the chip
and the antenna. The Thinlam® prelaminates maintain the highest
durability thanks to the patented chip connection technology, which
achieves tighter resonance frequency tolerances. KSW Thinlams® are
manufactured without chip modules, ensuring an exceptionally plane
card surface without sink marks. The technology is successfully
proven and the Thinlam® guarantees durability and reliability.

In addition, as both sides of the card are fully opaque executable,
both the chip and the antenna are visually screened. Therefore any
potential deformation areas on the card are avoided when using KSW´s
Thinlam®. Other common restrictions regarding visual card
personalization are eliminated, allowing for new features to be
applied above the chip area of the card, if required.

Thinlam® is available in polycarbonate, PVC, PET or Teslin® and can
also be used for transparent RFID cards due to the excellent optical
appearance.

KSW´s new Thinlam® generation of thinnest RFID prelaminates are
commonly used manufacturing government ID documents including
passports, driver´s licenses and identity cards and are also widely
used in the ePayment sector.

About KSW KSW Microtec AG, with its headquarters in Germany, is the
world´s leading supplier of RFID (Radio Frequency Identification)
components for applications such as eTicketing, ePayment, Asset
Management, Access Control and High Security. KSW combines successful
high-end wafer processing, extremely efficient assembly technology
and far-reaching expertise in design. KSW has earned itself a leading
position on the market as one of the most efficient, and
simultaneously most flexible, producers of RFID components. The
globally active company was founded in 1994 and has clean room
production facilities in Germany. KSW is an investment holding of the
listed venture capital company Deutsche Effecten- und
Wechsel-Beteiligungsgesellschaft AG headquartered in Jena. For more
information see: www.ksw-microtec.de

For further information, please contact:

Sandra Jaunich
KSW Microtec AG
Manfred-von-Ardenne-Ring 12
01099 Dresden - Germany
Tel: +49 351 889 60 28
Fax: +49 351 889 60 11
sandra.jaunich@ksw-microtec.de
www.ksw-microtec.de

Media contact:
Tim Cockerell
Wise Media S.p.A.
Via Lepetit 4
20124 Milano - Italy
Tel: +39 02 8903 4126
Fax: +39 02 67388322
tim.cockerell@wisemedia.com
www.wisemedia.com

end of announcement euro adhoc
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ots Originaltext: Deutsche Effecten- und Wechsel-Beteiligungsges. AG (DEWB)
Im Internet recherchierbar: http://www.presseportal.de

Further inquiry note:

Marco Scheidler

Tel.: +49 (0) 3641 573-3600

E-Mail: marco.scheidler@dewb-vc.com

Branche: Financial & Business Services
ISIN: DE0008041005
WKN: 804100
Index: CDAX, Classic All Share, Prime All Share
Börsen: Frankfurt / regulated dealing/prime standard
Berlin / free trade
Stuttgart / free trade
München / free trade